Partnered Manufacturers
Unimicron Technology Corp.
- Boards/Devices
- Boards
- Handling Regions
- Japan
- North America Region
- Southeast Asia and India Region
(Please contact us for North America Region, Southeast Asia and India Region Sales Chanel.)
The world's third-largest general substrate manufacturer, with sales of 2.035 billion USD in 2015.
Unimicron is the world's top manufacturer of HDI substrates and has long been the leader in communications-oriented substrate fabrication. Since our full-scale entry into the automotive application market in 2008, we have been well respected around the world for our distinguished technical expertise seen in thick copper, copper inlay, semi-flex, rigid-flex, and other PCBs.
These products are built for harsh environments (thermal shock), long-term operation (long warranty periods), and technical quality that aims for 0 DPPM.
HDI substrates
Hi Cu PCB
Multilayer thick copper substrates are technologies that can integrate power and control units on the same substrate. Examples: inner layers for power units, and outer layers for control units
With their better thermal diffusion at better rated voltages, thick copper substrates can be mass-produced through standard processes.
With their better thermal diffusion at better rated voltages, thick copper substrates can be mass-produced through standard processes.
Copper inlay
A substrate ideal for controlling instantaneously and locally generated heat.
It can provide the minimum amount of direct contact of copper (thermal conductivity:400W/mK) to the problem element. A special technology that decreases the weight load and makes possible a variety of thermal control techniques.
It can provide the minimum amount of direct contact of copper (thermal conductivity:400W/mK) to the problem element. A special technology that decreases the weight load and makes possible a variety of thermal control techniques.
Supplier overview
- Supplier Name
- Unimicron Technology Corp.
- Estabished
- Nov. 20, 1990