- LANTRONIX, INC.
- ICT and Industrial
- Smart Factories and Robotics
Global provider of solutions for Remote Environment Management (REM)
Lantronix:
System on Module (SoM) with Qualcomm IoT Application Processors
Lantronix provides System on Module (SoM) with Qualcomm IoT Application Processors, and strives to provide end-to-end solutions for OEMs/ODMs by combining new disruptive technologies such as AI, 5G, IoT, and cloud computing, helping accelerate the process from product prototype to mass production for a wide range of industries and developers, including smart cameras, robotics, VR/AR, wearables, drones, medical devices, and industrial IoT.
Lantronix Products
System on Module(SoM) and System in Package(SiP)
Lantronix offers System on Module (SoM) and System in Package (SiP) solutions featuring Qualcomm Application Processors, the next-generation high-tech chipsets for the Internet of Things (IoT).
Each processor is classified into four categories: Premium/High/Mid/Entry. The System on Module (SoM) and System in Package (SiP) specifications for the four major chipset products are outlined below.
OTHERS, we can propose System on Module (SoM) and System in Package (SiP) that are optimal for your specific use case and target specs.
| SoM and SiP | TurboX C5165 | TurboX C610 | TurboX C4290 | TurboX C2290 |
|---|---|---|---|---|
| Qualcomm Chipset | QRB5165 | QCS610 | QCS4290 | QCS2290 |
| Grade | Premium | High | Mid | Entry |
| CPU | Kryo 585 | Kryo 460 | Kryo 260 | 4x Arm Cortex-A53 |
| GPU | Adreno 650 | Adreno 612 | Adreno 610 | Adreno 702 |
| DSP | Hexagon 698 DSP with Quad HVX | Hexagon DSP | Hexagon 683 compute DSP with dual HVX | Hexagon V66 DSP |
| Video | Video Processor Dec: 8K60 Enc: 8K30 | Video Processor Dec: 4K30 Enc: 4K30 | Video Processor Dec: 1080p60 Enc: 1080p60 | Video Processor Dec: 1080p30 Enc: 1080p30 |
| Memory | LPDDR5 | LPDDR4x | LPDDR4x | LPDDR4 |
| Connectivity | Wi-Fi 6 Bluetooth 5.1 | Wi-Fi 5 Bluetooth 5.0 Ethernet: RGMII | Wi-Fi 5 Bluetooth 5.0 | Wi-Fi 5 Bluetooth 5.0 |
| Location | None | GPS/GLONASS, BeiDou, Galileo | GPS/GLONASS, BeiDou, Galileo | GPS/GLONASS, BeiDou, Galileo |
| Size | 45mm x 56mm | 38mm x 38mm | 35mm x 51mm | 34mm x 35mm |
Open-Q™ 5165RB SoM Specifications
Open-Q™ 610 μSOM Specifications
Open-Q™ 4200 Series SIP Specifications and Block Diagram
Open-Q™ 2200 Series SIP Specifications
Development Kit (DVK)
Lantronix also provides a Development Kit (DVK) equipped with an SoM for development purposes, as well as a Camera Module for connecting to the DVK, to support customer development.
By utilizing the development kit (DVK) and establishing a platform for the developed product, it is possible to reduce development time and costs.
We have prepared a development kit (DVK) for each System on Module (SoM) and System in Package (SiP), so we can propose a compatible DVK. Please contact us for detailed technical information.
| SoM/SiP | Open-Q™ 5165RB | Open-Q™ 610 | Open-Q™ 4290 | Open-Q™ 2290 |
|---|---|---|---|---|
| Qualcomm Chipset | QRB5165 | QCS610 | QCS4290 | QCS2290 |
| Grade | Premium | High | Mid | Entry |
| Kit | Open-Q™ 865 Development Kit for 865XR/ 5165RB/8250CS (SOM not included) | Open-Q™ 610 µSOM Development Kit | Fully Assembled Development Kit for Open-Q™ 4290 SIP Series | Fully Assembled Development Kit for Open-Q™ 2290 SIP Series |
| Kit related products | ・Audio Input Test Board ・Audio Output Test Board ・Open-Q™ LCD Panel ・Open-Q™ IMX258 Camera | ・Open-Q™ LCD Panel Open-Q™ IMX258 Camera |