Qualcomm's Dragonwing series industrial SoCs enable edge AI and high-performance computing | NEXTY Electronics, a trading company for electronic components and semiconductors

Qualcomm Technologies, Inc.

Qualcomm is a semiconductor company headquartered in San Diego, California, USA.
Widely known for its "Snapdragon" chipset for smartphones, the company leverages its long-standing mobile technology to expand its business into a wide range of fields, including automotive, IoT, and industrial equipment.
Dragonwing is a Qualcomm brand alongside Snapdragon, and is being developed for industrial and embedded IoT applications.
Featuring real-time processing via on-device AI and industrial-grade reliability designed for long-term supply, it enables advanced AI processing at the edge while reducing reliance on the cloud.
In addition to providing chipsets, Nexty Electronics, in collaboration with Qualcomm's partner companies, can also propose and provide SoM (System on Module), boards, and boxes according to your needs. Please feel free to contact us for more information.

Features of Dragonwing

Edge AI

Achieve AI processing on-device, without relying on the cloud.

High performance and low power consumption

Leveraging technologies developed for mobile devices, we have achieved both high performance and excellent power efficiency.
We support the long-term operation of industrial equipment.

Multi-platform compatible

Supports a wide range of operating systems including Windows, Linux, and Android.

Long-term supply for over 10 years

Supports long-term operation required for industrial equipment.
We provide long-term support for our products through stable supply and ongoing support.

Dragonwing Roadmap

Dragonwing offers a wide range of products that meet diverse performance and power consumption requirements, while providing the high quality and reliability demanded by industrial equipment.
By providing the advanced AI computing power and excellent scalability required for physical AI, we offer optimal solutions that meet the diverse needs of our customers, supporting the development of next-generation industrial equipment and innovative products.

Product		IQ9	IQ8	QCS6490	IQ6
CPU		2x 4-core Kryo Gold Prime @ Up to 2.36 GHz	2x 2-core Kryo Prime @ Up to 2.35 GHz 2x 2-core Kryo Gold @ Up to 2.1 GHz	1x Kryo Prime @ Up to 2.7 GHz 3x Kryo Gold @ Up to 2.4 GHz 4x Kryo Silver @ Up to 1.9 GHz	2x Kryo Gold @ 1.9 GHz 6x Kryo Silver @ 1.6 GHz
GPU		Adreno 663 @ Up to 800 MHz	Adreno 623 @ Up to 877 MHz	Adreno 643 @ Up to 812 MHz	Adreno 612 @ 845 MHz
AI Performance		Up to 100 TOPS	Up to 40 TOPS	Up to 12 TOPS	Up to 1.1 TOPS
Memory		6x 16 LPDDR5 @ 3200 MHz Up to 36 GB	4x 16-bit LPDDR5 @ 3200 MHz Up to 32 GB	2x 16-bit LPDDR5 @ 3200 MHz Up to 16 GB	2x 16-bit LPDDR4X @ 1555 MHz Up to 8 GB
Camera		24-bit HDR safe ISP 4x 4-lane CSI2 2.4 GPix/s throughput	24-bit HDR safe ISP with RGB-IR CFA 3x 4-lane CSI2 2.4 Gpix/s throughput	24-bit HDR ISP (Qualcomm Spectra 570L) 5x 4-lane CSI (D-PHY v1.2/C-PHY v1.2) 2.4 GPix/s throughput	14-bit Bayer ISP (Qualcomm Spectra 230) 3x 4-lane CSI (D-PHY v1.2/C-PHY v1.0) 1.2 GPix/s throughput
Video Decode		4K @ 275fps (AV1, HEVC, H.264, H.265, VP9, MPEG-2)	4K @ 120fps (AV1, HEVC, H.264, H.265, VP9, MPEG-2)	4K @ 60fps (H.264, H.265, VP9)	4K @ 60fps (H.265, H.264, VP9, VP8, MPEG-2)
Video Encode		4K @ 170fps (HEVC, H.264, H.265)	4K @ 60fps (H.264, H.265)	4K @ 30fps (H.264, H.265)	4K @ 30fps (H.265, H.264, VP8)
Display Support		2x MIPI DSI (4 lanes) 4x eDP/DP v1.4	1x MIPI DSI (4-lanes) 1x DP v1.4	1x MIPI DSI (4 lanes) 1x DP v1.4 (via USB Type-C)	1x MIPI DSI (4 lanes) 1x DP v1.4
Audio	DSP subsystem	LPASS with dedicated Hexagon DSP	LPASS with dedicated Hexagon DSP	LPI with Hexagon DSP V66M	LPASS with Hexagon V66 DSP
	DSP performance	1980 MPPS	1270 MPPS	1980 MPPS	759 MPPS
	LS-I2S/MI2S	LS-I2S: Up to 10	LS-I2S: Up to 8	MI2S: Up to 6	LS-I2S: Up to 5
	Data lane configuration	7×2-lane + 3×reconfigurable	5×2-lane + 2×muxed + 1×reconfigurable	5×2-lane + 1×4-lane	4×2-lane + 1×4-lane
	PCM/TDM	Up to 10	Up to 10	Not Specified	Up to 5
	HS-I2S	5 receive (up to 73.728 MHz)	3 receive (up to 73.728 MHz)	Not Specified	2 receive (up to 65.536 MHz)
Storage		2x UFS 3.1 gear 4 - 2 lanes 1x eMMC 5.1/SD card 1x NOR flash memory 1x NVMe	1x UFS 3.1 gear 4 - 2 lanes 1x eMMC 5.1/SD Card 1x NOR flash memory 1x NVMe	1x UFS 2.x/3.1 gear 4 - 2 lanes 2x SD card/eMMC 5.1 1x NVMe	1x UFS 2.1 gear 3 - 1 lane 2x SD 3.0/eMMC 5.1
PCIe		1x 2-lane PCIe Gen4 1x 4-lane PCIe Gen4	1x 2-lane PCIe Gen4 1x 4-lane PCIe Gen4	1x 1-lane PCIe Gen3 1x 2-lane PCIe Gen3	1x 1-lane PCIe Gen2
USB		2x USB 3.1 Gen 2 1x USB 2.0	1x USB 3.1 Gen 2 1x USB 2.0	1x USB 3.1 Gen 1 1x USB 2.0	1x USB 3.1 Gen 1 1x USB 2.0
Ethernet	Ethernet MAC	Integrated	Integrated	None	Integrated
	PHY	External	External	Not Available	External
	Integrated Ethernet Interface	1x RGMII 2x SGMII	1x RGMII 1x SGMII	None	1x RGMII / RMII
MCU-Like Subsystem		4× Real-time Cores @ 1.85 GHz	4× Real-time Cores @ 1.85 GHz	None	None
CAN		8× CAN-FD	4× CAN-FD	None	None
GPIO		149× GPIO	133× GPIO	169× GPIO	123× GPIO
Other I/O		UART/I2C/SPI/I3C	UART/I2C/SPI/I3C	UART/I2C/SPI/I3C	UART/I2C/SPI
OS		Linux Yocto, Ubuntu	Linux Yocto, Ubuntu	Android, Yocto, Ubuntu, Windows	Linux Yocto, Ubuntu
Package		FCBGA1723 + HS 25.0 x 25.0 x 2.31 mm ball pitch: 0.6 mm	FCBGA1326 + HS 25.0 x 25.0 x 2.76 mm ball pitch: 0.9 mm	1287-FBGA (Fine Pitch BGA) 14.0 x 12.0 x 0.91 mm ball pitch: 0.35 mm	FCBGA761 + HS 23.0 x 23.0 x 2.45 mm ball pitch: 0.8 mm
Temp. Range (Tj)		-40℃ to 115℃	-40℃ to 125℃	-30℃ to 105℃	-40℃ to 105℃
Longevity Program*		2038	2038	2036	2038
Data Sheet		IQ9 Data sheet	IQ8 Data sheet	QCS6490 Data sheet	IQ6 Data sheet

For more details, please visit the manufacturer's website.

*The supply period may change without notice.
For more details, please check the Qualcomm website.
https://www.qualcomm.com/internet-of-things/products/product-longevity-program

Market segment

Autonomous forklift
Humanoid robot
Autonomous agricultural and construction machinery

Multifunction printer
Industrial computers
Industrial robots

Evaluation kit

IQ-9075 Evaluation Kit
Dragonwing IQ-9075 SoC Evaluation and Development Kit

For more details, please visit the manufacturer's website.
RB3Gen2 Development Kit
Edge AI platform based on the QCS6490 processor

For more details, please visit the manufacturer's website.

Nexty Electronics provides comprehensive support for setting up development environments based on Dragonwing, and together with our customers, we realize optimal solutions that look ahead from the initial stages of product development to mass production.