H(EV) Electrical Vehicle Application

Automotive (in-vehicle) applications

H(EV) Electrical Vehicle Application

H(EV) Electrical Vehicle Application
Infineon boasts a wide range of power semiconductor products and cutting-edge technology and products, and is also a manufacturer with comprehensive support for automotive semiconductors. We can introduce you to a wide range of products, including not only automotive IGBTS and driver ICs, but also MOS FETS, communication ICs, POWER SUPPLIES ICs, and microcontrollers. Please take a look at Infineon's technology and products for EV applications. This is something you won't want to miss.

Circuit diagram explanation

Circuit diagram explanation
While hybrid electric vehicles (HEVs) and electric vehicles (EVs) are far more energy-efficient than vehicles using internal combustion engines, there is still plenty of room for improvement. Reducing power loss, saving energy, and improving overall performance are universal challenges for the industry as a whole, including our customers, as HEVs and EVs develop in the future. Functional safety, including compliance with ISO 26262, is also becoming increasingly important.

With extensive experience in industrial and automotive sectors, Infineon offers a broad range of highly efficient electric powertrain components, making it the ideal partner for all hybrid electric and electric vehicle requirements. Our proven IGBT MODULES and bare die solutions are particularly noteworthy. Leverage our comprehensive technical support to ensure the success of your designs. In fact, we are currently collaborating with many customers to co-develop the drivetrains of the future.

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<This is what engineer KENYA wants to say!!>
Infineon offers automotive-grade IGBT MODULES and DISCRETE IGBTS that can be used in the design of hybrid and electric vehicles.
Low conduction loss and high reliability. For these reasons, Infineon has developed reverse conduction (RC) drive IGBTS. By integrating DIODES, it offers the advantage of space reduction and is also a cost-optimized solution. Furthermore, this technology delivers smooth SWITCHES operation and excellent performance with low EMI (electromagnetic interference) levels even at a maximum junction temperature of 175°C.

Infineon has developed new power semiconductor modules designed for hybrid vehicle applications, based on the HybridPACK™ family. Each product is designed to address the diverse requirements of mild-hybrid and full-hybrid applications. Six different package options offer a wide range of design integrations.

The Automotive Easy1B and Easy 2B modules provide a flexible topology platform for applications in the power range of 6kW or less. The Automotive Easy module series is based on the well-established Industrial Easy modules. As high-voltage battery systems become a reality in HEVs (hybrid electric vehicles) and EVs (electric vehicles), efficiency improvements and cost reductions will be possible even in some applications powered by low-voltage boardnets (14V) in internal combustion engine vehicles.


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