NXP products
SoC
NXP's automotive application processors: i.MX RT is ideal for safety control with real-time control and high-performance MCU fusion. i.MX 8 delivers advanced in-vehicle infotainment with high-performance multi-core. i.MX 9 adapts to next-gen automotive systems with low power and enhanced security.
Automotive Application Processors
Introducing i.MX RT (Crossover MCU)
i.MX RT crossover MCUs combine ease of use with high-performance processing.
The i.MX RT series offers many variations that achieve high integration and security with optimal power consumption while driving industrial, IoT, and automotive applications.
i.MX RT crossover MCUs are supported by the MCUXpresso ecosystem, including SDK, various IDEs, secure provisioning, and configuration tools, enabling rapid development.
i.MX RT1170 Block Diagram
Introducing i.MX 8/9 Series
i.MX 8 Series
i.MX 8 series application processors are scalable multi-core platforms with single, dual, and quad-core families based on Arm Cortex architecture, integrating Cortex-A72 + Cortex-A53, Cortex-M4, Cortex-M7 solutions for advanced graphics, imaging, machine vision, audio, video, and safety-critical applications.
i.MX 9 Series
i.MX 9 series application processors are based on i.MX 8 series, combining high-performance application cores, MCU-like independent real-time domains, Energy Flex architecture, cutting-edge security via EdgeLock® secure enclave, and dedicated multi-sensory data processing engines (graphics, image, display, audio, voice). Part of the EdgeVerse™ edge computing platform, many products integrate hardware neural processing units to accelerate ML applications at the edge.
i.MX 8/9 Application Examples
- Automotive
- Industrial Vehicle
- Advanced Industrial HMI&Control
- Robotics
- Building Control
- Healthcare
- General Purpose HMI Solutions
i.MX 6/7/8/9 Series Feature Overview
i.MX 93 Block Diagram
i.MX 935x/933x
i.MX 93 Evaluation Board
The i.MX 93 EVK for 11×11mm samples provides a platform for comprehensive evaluation of the i.MX 93 application processor.
It also includes power rail consumption measurement capabilities.
This kit includes the following three interconnected boards:
●Computing Module (Standard 6-Layer Technology)
Equipped with superset i.MX 93 SoC (MIMX9352CVVXMAB), 2GB LPDDR4X, 16GB eMMC, NXP PMIC (PCA9451A), and power monitoring circuit.
Connectivity Base Board
Equipped with standard M.2 E-KEY slot, allowing connection of off-the-shelf connectivity modules such as Wi-Fi/BLE and LTE modules manufactured by NXP partners.
●M.2 Module
Equipped with Murata LBES5PL2EL module (including NXP Wi-Fi 6 + BT 5.2 + IEEE 802.15.4 tri-radio IW612 chipset), connected to onboard Wi-Fi/BT dual antenna.
