NEXTY Electronics BGA Rework Service

In recent years, systems on chip (SOC) have increasingly adopted high-pin count and fine-pitch BGA packages.
NEXTY Electronics has introduced dedicated rework equipment to perform SOC replacement and reballing on boards developed by customers.

In this column, we will provide an overview of BGA board repair and introduce our rework services.

This service is available to everyone, so if you are interested, please Inquiry.

Overview of BGA PCB Repair

BGA board rework

BGA packages have solder balls arranged on the backside of the IC body, making them components that cannot be repaired with a soldering iron.
Furthermore, in recent years, BGAs have become increasingly fine-pitch and have more pins, making it difficult to transfer heat evenly using a hot plate or hair dryer, making it difficult to remove and replace ICs without damaging the functionality of the board.

At NEXTY Electronics, we use the latest specialized equipment, allowing us to replace ICs while minimizing the strain on the circuit board and ICs.

BGA board rework procedure

1. Preparation

Clean the work area and prepare any pre-processing and materials needed (rework station, solder, flux, stencil, etc.).
2. Heating the board and removing the IC

The rework station automatically heats the board and removes the IC. The heating temperature and time are adjusted according to the specifications of the board and IC.
3.Removing old solder

Remove the old solder from the board.
4. Reattaching to the board

New or reballed ICs are remounted on the board. This is also automatically placed and heated.
5. Final Check

X-ray and visual inspections are used to check whether the IC is installed correctly and whether the solder joints are good.
6. Testing (Optional)

Finally, we check the operation of the entire board to confirm that the rework was successful.

BGA package reballing

BGA package reballing is the process of attaching new solder balls to a BGA (Ball Grid Array) packaged IC after it has been removed from the board and is ready for re-installation.
This procedure is necessary when replacing or repairing an IC. The standard reballing procedure is explained below.

BGA package reballing procedure

1. Preparation

Prepare the necessary tools and materials (new solder balls, solder paste, flux, metal mask, etc.).
2.Removal of old solder balls

We will remove any old solder remaining on the backside of the IC and clean it.
3. Placement of new solder balls

New solder balls are placed on the pads of the IC, typically by using a metal mask to precisely apply solder paste and then place the balls.
4. Reheat

Heat the new solder balls again to firmly bond them to the IC pads.
The heating temperature and time are adjusted according to the IC specifications.
5. Cooling

Allow the IC to cool and watch the solder balls harden.
6. Final Check

We check whether the solder joints are good by X-ray inspection and visual inspection.

Strengths of NEXTY Electronics' BGA rework work

Short delivery time
Work can be commissioned from one unit
X-ray inspection can be performed to check whether the product is good or bad.

Proper temperature control is very important in BGA rework work.
Careful work is required as overheating or uneven cooling can damage the board and ICs.
Furthermore, by properly reballing BGA packages, we enable the reuse of ICs, contributing to cost reduction and environmental protection.
Please leave your BGA rework work to us with peace of mind.

This service is available to everyone, so if you are interested, please Inquiry.

BGA rework example

Important points to note: Advance preparation

Rework work may require advance preparation. For first-time requests, we would appreciate it if you could contact us at least one month before your desired delivery date.
Examples of advance preparation:
Solder ball material: We will confirm the required size and material and prepare it.
Metal mask: We will prepare the metal mask required for reballing according to the package.
This preparation takes about a week.

Inquiry