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Vishay Intertechnology, Inc.

PowerPAIR® Delivers High-Efficiency, High-Power-Density MOS FETS Power Stages—An Integrated Solution Accelerating Next-Generation DC/DC Converter Design

Vishay Intertechnology, Inc.
Vishay Intertechnology, Inc.
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As the performance of electronic devices such as servers, automotive ECUs, graphics cards, and communications equipment continues to improve, POWER SUPPLIES circuits are required to be more efficient and smaller than ever before. DC/DC converters in particular must be able to handle high currents within a limited board area while simultaneously suppressing SWITCHES losses caused by the on/off operation of MOS FETS and conduction losses due to on-resistance.
Vishay's PowerPAIR® series is a "Half-Bridge MOS FETS stage" that integrates the high-side and low-side MOS FETS used in DC/DC converters into a single package. By optimizing the internal SWITCHES node connection, the parasitic INDUCTORS that is unavoidable in DISCRETE configurations is significantly reduced, simultaneously achieving high efficiency, compact size, and high reliability.
This article systematically summarizes the technical features of PowerPAIR®, comparisons with competing products, application examples, and the product lineup, providing a perspective for considering optimal options for next-generation DC/DC converter designs.

Technical explanation

What is PowerPAIR®?

PowerPAIR® is an integrated MOS FETS power stage that combines a high-side (control) MOS FETS and a low-side (synchronous rectification) MOS FETS in a single package. By internally connecting the half-bridge configuration with the shortest possible distance, parasitic INDUCTORS is significantly reduced, suppressing voltage ringing and EMI during SWITCHES.
Furthermore, Vishay's Gen IV MOS FETS technology achieves both low RDS(ON) and low Qg, significantly contributing to high-frequency operation and improved power density.

PowerPAIR® Technical Advantages

High efficiency

Optimized internal connections reduce SWITCHES and conduction losses, resulting in efficiency improvements of up to 1.5% compared to comparable DISCRETE solutions.

Reduced board area

The PowerPAIR® 6x5FSW is extremely compact at just 31mm², achieving approximately 50% space savings compared to a configuration with two DISCRETE MOS FETS (approximately 62mm²).

Automotive quality (Wettable Flank)

The step-cut TERMINALS stabilize the solder fillet formation, making AOI (Automated Optical Inspection) easier. With a high reliability of 175°C, it is also ideal for automotive ECU and ADAS applications.

Improved thermal performance (Flip-Chip structure)

By flip-chip fabricating the low-side MOS FETS,

  • Reduced thermal resistance inside the package
  • Expanded contact area with PGND
  • Suppresses temperature rise during high current

There are thermal benefits.

  • PIN placement

  • Internal structure

Comparison with competitive products

PowerPAIR®'s competitors are integrated power stages made by several overseas companies. The table below compares them in terms of technical characteristics, mountability, and automotive compatibility.

ItemVishay PowerPAIR®Overseas Company AOverseas company BOverseas company Ccomment
structureMOS FETS
Integrated Half-Bridge
MOS FETS + DriverMOS FETS
Integrated Half-Bridge
MOS FETS + DriverDriver Selection
High degree of freedom
package6×5FSW / 3×3FSWQFNLFPAK / TOLLPQFNFor automotive use
Wettable Flank compatible
RDS(ON)Minimum 1.5 mΩ2 to 4 mΩ1.7 to 3 mΩ2 to 5 mΩTop class in the 40V range
Qg30 to 70 nC40 to 80 nC35 to 90 nC40 to 100 nCAdvantageous for high frequency operation
Automotive compatibleAEC-Q101partpartpartExtensive in-vehicle line

The major strengths of PowerPAIR® are its flexibility in selecting driver ICs and its high automotive quality.

Application circuit example

DC/DC converter (synchronous rectification type buck)

This is where PowerPAIR® is most effective.

  • Server POWER SUPPLIES
  • GPU/CPU VRM
  • Local POWER SUPPLIES for automotive ECUs
  • POL POWER SUPPLIES for communication equipment

High frequency operation also enables miniaturization of INDUCTORS and CAPACITORS.

ADAS/Automotive Zonal Architecture

With a 175°C rating, wettable flank, and a high voltage lineup of 40 to 100 V, these devices are ideal for POWER SUPPLIES for next-generation ECUs and sensor modules.

Wireless charging and motor drive

Half-Bridge configuration can be used as is,

  • Transmission side half-bridge
  • Small motor driver
  • Battery Management

This simplifies circuit design for applications such as:

DC/DC converter layout example

Product lineup

PowerPAIR® 6x5FSW (40-100V) — For high current and high efficiency applications

Part NumberVDS (V)R DS(ON) (mΩ) Max.Q g (nC) Typ.C oss (pF)
@VDS = 25V
Qualify-able
Samples
Release
Target
VGS = 10VVGS = 4.5VGS = 10VVGS = 4.5
HSLSHSLSHSLSHSLSHSLSHSLS
SQZF140ELPW40401.51.52.42.47272373710961096NowNow
SQZF140EPW40401.731.73--5858--11381138Q1 2026Q2 2026
SQZF142ELPW40402.612.614.14.142421919635635Q3 2025Q4 2025
SQZF142EPW404033--3434--659659Q3 2025Q4 2025
SQZF160ELPW60602.82.84.64.665.565.529.529.510001000Q3 2025Q4 2025
SQZF580ELPW80804.354.356.686.6830.530.51414775775Q2 2025Q3 2025
SQZF180ELPW80805.25.26.76.7676732.432.4547547Q1 2025Q2 2025
SQZF180EPW80805.85.8--5353--400400Q3 2025Q4 2025
SQZF110ELPW1001009.99.911.711.7595928.528.5221221Q3 2025Q4 2025
SQZF110EPW1001001111--4747--250250TBDTBD

PowerPAIR® 3x3FSW (40-100V) — For compact, high-density applications

Part NumberVDS (V)R DS(ON) (mΩ) Max.Q g (nC) Typ.C oss (pF)
@VDS = 25V
Qualify-able
Samples
Release
Target
VGS = 10VVGS = 4.5VGS = 10VVGS = 4.5
HSLSHSLSHSLSHSLSHSLSHSLS
SQZF340ELNW40405.295.378.248.3725.42510.410.3300295NowQ4 2025
SQZF360ELNW606010.910.618.117.616.116.77.37.5309319Q1 2026Q2 2026
SQZF3xxELNW72721313.218.218.51161142020116114TBDTBD
SQZF380ELNW808017.116.626.525.77.783.63.7197203Q1 2026Q2 2026
SQZF310ELNW10010039.838.546.845.414.51577.25556Q4 2025Q1 2026
  • PowerPAIR® 6×5FSW

  • PowerPAIR® 3×3FSW

Summary

The PowerPAIR® series is

  • High efficiency through MOS FETS integration
  • Reduced board area
  • Automotive quality reliability
  • Achieving high power density

This solution offers many advantages, and represents a major evolution over conventional DISCRETE MOS FETS configurations.
With the current demand for smaller and more efficient POWER SUPPLIES circuits, PowerPAIR® is becoming the "new standard" in the design of next-generation DC/DC converters. We can also support you in selecting the optimal product for your application, so please feel free to contact us for a consultation.

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