Good Product Analysis Services | NEXTY Electronics Quality and Analysis Support

Good Product Analysis refers to the process of evaluating and analyzing the quality of products.
In general, to assess product reliability—especially the progression of aging degradation—accelerated testing is commonly used as a reliability evaluation method. Accelerated testing is effective for predicting product lifespan and observing degradation in a short period. However, such tests often require 500 to 3,000 hours, and in some cases, even 4,000 to 5,000 hours.When evaluating a wide range of components and models, this can lead to limitations in available testing resources and time.
In such cases, Good Product Analysis offers an alternative approach to evaluate reliability in an even shorter timeframe.

In Good Product Analysis, the fundamental concept is that even if a product is currently functioning properly (i.e., its electrical characteristics are within specifications), it may still possess latent factors that could lead to failure over time due to aging degradation. This approach involves conducting physical analysis to identify such latent failure factors in advance and evaluate the product’s reliability.
By analyzing non-defective products, it becomes possible to assess usage risks. Products identified as having high risk can be excluded from use, leading to preventive measures and quality improvement.

Good Product Analysis can be effectively utilized in the following situations:

• When switching from conventional components to new ones, and baseline data is needed for reference.
• When you want to disassemble a product to understand its internal structure.
• When you need to verify whether countermeasures have been properly implemented in components that previously experienced issues.

NEXTY Electronics has a proven track record of providing good product analysis services to many Tier1 customers, with numerous repeat requests reflecting their trust in our capabilities. We own in-house reliability acceleration testing equipment, allowing us to conduct tests internally and support post-test good product analysis as well.
If you wish to analyze multiple types of samples through acceleration testing and good product analysis in a single request, we offer a cost-effective solution by placing all samples into the same test chamber—provided the temperature and humidity conditions for the acceleration test are the same across samples.
If you are facing challenges such as limited resources for acceleration testing or good product analysis of devices, please feel free to consult NEXTY Electronics. We are here to help.

Good Product Analysis – Inspection Items

At NEXTY Electronics, we conduct comprehensive investigations from external appearance to internal structure to identify potential factors that could lead to failures.

The table below shows the standard good product analysis menu for ICs.
If you would like to remove unnecessary items or add specific inspections—such as observing chip layer structures using FIB or inspecting die pads through mechanical decapsulation—please feel free to contact us. We offer flexible customization to meet your needs.
We also support analysis of discrete components, including resistors, capacitors, coils, diodes, transistors, and MOS devices.

Analysis Method (Equipment)	Main Analysis Area	Main Analysis Items
Visual Inspection (Microscope)	Mold Resin	Dimensions
		Scratches, cracks, chips, dents
		Incomplete mold filling
		Discoloration
		Foreign material adhesion
		Mold resin burr
	Marking	Marking abnormalities (blur, smudge, break, misalignment, etc.)
	Lead / Die Pad	Scratches, cracks, dents
		Plating peel-off
		Deformation, bending
		Discoloration
		Foreign material adhesion
		Burr
X-ray Inspection	Mold Resin	Foreign material contamination
	Lead / Die Pad	Shape abnormalities
		Cracks
	Die Attach	Bonding area (void ratio)
		Overflow
		Climbing
	Wire	Wire sweep
		Edge touch
		Wire proximity
Ultrasonic Testing (Acoustic Microscope)	Mold Resin	Resin voids
		Interface delamination with chip
		Interface delamination with inner lead
		Interface delamination with die pad
	Die Attach	Die attach delamination
Resin Decapsulation Analysis (Various Chemicals) (Microscope) (SEM)	Chip	Cracks/chips at dicing area (surface)
		Cracks/chips at dicing area (side)
		Dicing TEG residue
		Chip surface discoloration
		Passivation layer cracks
		Wiring corrosion
	Wire	Wire sweep
		Edge touch
		Scratches, cracks, thinning
		Wire proximity
		Neck cracks
		1st bond position
		2nd bond position
		Ball bond shape
		Crescent bond shape
		Bonding peel-off
	Pad	Clustering
Cross-sectional Observation (Mechanical Polishing) (Ion Milling)	Bonding	Bonding cross-sectional connection condition
	Mold Resin	Filler shape
	Lead	Lead plating material and thickness
	Chip	Chip thickness / Presence and thickness of polyimide