Partnered Manufacturers
Dynamic Electronics Co.ltd.
- Boards/Devices
- Boards
- Handling Regions
- Japan
- North America Region
- Southeast Asia and India Region
- East Asia Region
- Europe Region
Dynamic is PCB suppliyer production based in China.
Sales 432MUSD/2018(world ranking 42th), for auto motive PCB: 180MUSD/2018(WR 13th),main cutomer is auto-PCB application.New factory located Huangshi city, Hubei is an automation factory utilized 'Big Data' and 'AI'.(compliant Industrial 4.0).Japanese team supports you in Japanese mind and language.(Belongs to 2 Japanese engineers.) (Ranking source:NTI Report)
High reliability PCB for automotive
High reliability PCB for automotive
Producted in Huangshi factory, Kunshan factory 340Km2/month
HF, Middle～High Tg
Layer：2～24L Copper thickness (Inner, Outer)：35～105um
Max PCB thickness：2.75mmt
・Thermal shock test -65℃(30min)～150℃(30min) 2,000 cycles
・Endurance CAF test 85℃85%RH DC100V 1,000Hr
・Heat-resistant 288℃ Solder float 10sec. x 6 times
HF, Middle～High Tg
Layer：2～24L Copper thickness (Inner, Outer)：35～105um
Max PCB thickness：2.75mmt
・Thermal shock test -65℃(30min)～150℃(30min) 2,000 cycles
・Endurance CAF test 85℃85%RH DC100V 1,000Hr
・Heat-resistant 288℃ Solder float 10sec. x 6 times
Build-up PCB (HDI)
Build-up PCB (HDI)
Producted in Kunshan factory 30Km2/month
HF, Middle～High Tg
Layer：2～24L Copper thickness (Inner, Outer)：35～105um
Max PCB thickness：2.75mmt
・Thermal shock test -65℃(30min)～150℃(30min) 2,000 cycles
・Endurance CAF test 85℃85%RH DC10
HF, Middle～High Tg
Layer：2～24L Copper thickness (Inner, Outer)：35～105um
Max PCB thickness：2.75mmt
・Thermal shock test -65℃(30min)～150℃(30min) 2,000 cycles
・Endurance CAF test 85℃85%RH DC10
High Frequency PCB
High Frequency PCB
24GHz, 77GHz Automotive Rader PCB
1 Low dissipation factor
2 Stable TCDk to temperature changes
3 Low CTE
4 PTTFE+FR-4 Mixed lamination
1 Low dissipation factor
2 Stable TCDk to temperature changes
3 Low CTE
4 PTTFE+FR-4 Mixed lamination
Rigid-flex, Semi-flex
Rigid-flex, Semi-flex
PCB can be folded small.
・Rigid-flex FPC area ：High flexibility
Rigid max 12 layer FPC max 6 layer
Min L/S(inner)=40/40um Min L/S(outer)=45/45um
・Semi-flex Design rule is as same as Rigid-PCB.
Bending layer 1-layer max bending angle 90° max bending 10cycles
・Rigid-flex FPC area ：High flexibility
Rigid max 12 layer FPC max 6 layer
Min L/S(inner)=40/40um Min L/S(outer)=45/45um
・Semi-flex Design rule is as same as Rigid-PCB.
Bending layer 1-layer max bending angle 90° max bending 10cycles
Supplier overview
- Supplier Name
- Dynamic Electronics Co.ltd.
- Estabished
- Aug. 1988
